Thermal Glue Circuit Board Adhesive Thermal Conductive Heatsink Viscous Adhesive Glue Compound CPU LED Heat Sink Sealant 1/3/5/8 pcs 5g Thermal Pads Conductive Heatsink Plaster Viscous Adhesive Glue for Chip VGA RAM LED IC Cooler Radiator Cooling 1. High strength and fast bonding effect, suitable for directly attaching various components, LEDs, and heat sinks. 2. Good thermal conductivity, strong adhesion, vacuum packaging resists oxidation and drying, good viscosity, short drying time. 3. Wide operating temperature range (-60°C to 200°C), short-term resistance up to 300°C. 4. Short surface curing time, long storage life, non-toxic, solvent-free, safe for use in electronic bonding, heat dissipation, insulation, and packaging applications. Instructions: 1) Extrude product directly during use, rub surface of adherend, and cover immediately after use. 2) Curing speed depends on ambient humidity and temperature; higher temperature results in faster curing. 3) Recommended thickness: 0.1–0.5 mm; thinner application is better. 4) Clean bonding surface with solvent such as alcohol before use; avoid detergents. Apply only after surface is fully clean. 6. Package sealed in vacuum bag to prevent air exposure and extend shelf life. Specifications: Thermal properties, strong adhesive bond Size: 5g (single unit) Weight loss: 0% (200°C / 24 hours) Evaporation: 0.001% (200°C / 24 hours) Thermal Conductivity: >0.671 W/m·K Impedance: 5.1 Scatter Coefficient: